Integrated Dual-Axis Gyroscope targets Fast Moving Games Controller Applications

Date: 25/6/2010

Featured in the Ismosys on-line store, the InvenSense ISZ-650 Z-axis is an integrated MEMS rate gyroscope designed for high performance game and audio-video remote controller units which require wide dynamic range motion processing, high impact shock resistance, and low cost.  The device can be utilized as a standalone yaw-rate sensor or, when combined with the InvenSense IDG-650 X/Y-axis gyroscope, as a complete 3-axis solution where all devices mount in plane with the rest of the system electronics.

The ISZ-650 includes all the integrated electronics required for complete application-ready functionality. Factory-trimmed scale factors eliminate the need for external active components and end-user calibration. An integrated AutoZero feature helps minimize bias drift over temperature. 

Key Features
• Integrated Z-axis gyro on a single chip
• Complements IDG-650 dual axis (X/Y) gyro, for a solution where all sensors mount in-plane with the rest of the system electronics
• Two separate outputs per axis for high-speed gaming applications and lower-speed menu navigation:
   - 2000°/s full scale range (high-speed gaming)
   - 440°/s full scale range (pointing)
• Low bias drift over temperature
• Auto Zero function
• Temperature sensor
• Integrated amplifiers & low-pass filters
• Highest cross-axis isolation by design
• Superior vibration rejection over a wide frequency range
• 10,000 g shock tolerance
• 3V single supply operation

Fast moving gaming applications have very specific system requirements: To cater for theses specifics the ISZ-650 features a primary output with a full-scale range of ±2,000°/sec, to track the widest range of physical motions and its secondary output has a full-scale range of ±440°/sec, for tracking slower motions, such as required in pointing applications.

Available in a fully RoHS and Green compliant 4 x 5 x 1.2 mm package the ISZ-650 Z-axis leverages InvenSense’s proprietary Nasiri-Fabrication design and manufacturing platform, where the MEMS and CMOS control electronics are bonded and hermetically sealed, allowing direct electrical interconnections and testing at the wafer level.  This approach minimizes parasitic capacitance and improves signal-to-noise ratios versus competitive solutions.